Industrial Grade Wafer Magneto Optic Kerr Measuring Instrument

Industrial Grade Wafer Magneto Optic Kerr Measuring Instrument

Product Instruction

Using the poloidal magneto-optical Kerr effect (MOKE), the magnetic properties of wafer stacks are quickly  and globally detected. Non-contact measurement avoids damage to the wafer by traditional magnetic  characterization, and can be applied to sample detection before and after patterning. Up to 2.5T vertical  magnetic field, which can induce the flipping of the free layer, reference layer and pinned layer of the vertical  anisotropic magnetic random access memory (MRAM) film stack; Ultra-high Kerr detection sensitivity, which  can characterize the subtle magnetic changes of different film layers at the same time. Combining laser pointbypoint detection with scanning imaging can quickly create a global map of wafer magnetic properties, assisting process optimization and yield control.

Performance Indicators 

1. Sample size: supports up to 12-inch wafer testing and is backward compatible,  supports fragment testing; 

2. Magnetic field: the maximum vertical magnetic field is better than ±2.5 T, and the magnetic field resolution is 1 μT; 

3. Magnetic detection sensitivity: Kerr rotation angle detection degree is better than 0.3 mdeg (RMS), suitable for  magnetic characterization of multilayer film stacks;  

4. Sample repeat positioning accuracy: better than ±1 μm, static jitter ≤±0.25μm. 

Functions and Application Scenarios

1. Vertical hysteresis loop measurement of MRAM stacks and device arrays (Polar Kerr for MRAM); 

2. Vertical hysteresis loop measurement of magnetic storage media such as disks (Polar Kerr for PMR Disk); 

3. Automatic extraction of hysteresis loop information, such as free layer and pinned layer Hc, Hex, Ms, etc.； 

4. It can quickly draw the distribution map of the magnetic properties of the wafer; the system presets single point,  array, ring distribution and other scanning point modes, and supports the import of custom position lists; 

5.The system provides manual loading or fully automatic operation to meet R&D/production needs.